BRIEF-Amkor Tech Breaks Ground On New Semiconductor Advanced Packaging In Arizona

Oct 6 (Reuters) – Amkor Technology Inc: * AMKOR TECHNOLOGY BREAKS GROUND ON NEW SEMICONDUCTOR ADVANCED PACKAGING AND TEST CAMPUS IN ARIZONA; EXPANDS INVESTMENT TO $7 BILLION * AMKOR TECHNOLOGY INC – FIRST FACILITY COMPLETION EXPECTED MID-2027, PRODUCTION IN 2028 * AMKOR TECHNOLOGY INC – INVESTMENT SUPPORTED BY CHIPS FOR AMERICA PROGRAM AND TAX CREDITS, STATE AND LOCAL GOVERNMENTS * AMKOR TECHNOLOGY INC: EXPANDED INVESTMENT INCLUDES ADDITIONAL CLEANROOM SPACE AND A SECOND GREENFIELD PACKAGING AND TEST FACILITY Source text: Further company coverage:

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